Infineon Enhances Power Density with CoolSiC MOSFETs
High-power applications, such as EV charging and commercial vehicles, are driving demand for higher system-level power density and efficiency.
To meet these demands, Infineon Technologies AG has launched the CoolSiC MOSFETs 1400V G2 in the TO-247PLUS-4 Reflow package, supporting higher DC-link voltages and improved thermal performance.
- Decreased system size
- Enhanced reliability
- Supports reflow soldering at 260C for up to three cycles
- Reliable operation with junction temperatures up to 200C
- High peak current capability
These demands introduce new design challenges, including reliable operation under harsh environmental conditions, robustness against transient overloads, and optimised overall system performance.
Author summary: Infineon launches CoolSiC MOSFETs for high-power applications.
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