imec Automotive Chiplet Program Expansion
GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, and TIER IV have joined imec's Automotive Chiplet Program (ACP), accelerating the development of cutting-edge chiplet architecture for the automotive industry.
The program aims to address the unique demands of the automotive industry, as vehicles become high-performance, software-defined platforms, requiring advanced driver assistance systems (ADAS), autonomous driving, and immersive in-vehicle infotainment.
- GlobalFoundries (GF) joined as a foundry partner
- Infineon, Silicon Box, STATS ChipPAC, and TIER IV committed to join ACP
Traditional monolithic chip designs are increasingly challenged to meet the demands of advanced driver assistance systems (ADAS), autonomous driving and immersive in-vehicle infotainment.
Author's summary: Companies join imec's Automotive Chiplet Program to accelerate chiplet architecture development.
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